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19-3383; Rev 0; 8/04 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch General Description The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB NF for UMTS/WCDMA, DCS, and PCS base-station applications. The MAX9995 is ideal for low-side LO injection. (For a mixer variant optimized for high-side LO injection, contact the factory.) This device integrates baluns in the RF and LO ports, a dual-input LO selectable switch, an LO buffer, two doublebalanced mixers, and a pair of differential IF output amplifiers. The MAX9995 requires a typical LO drive of 0dBm and supply current is guaranteed to be below 380mA. These devices are available in a compact 36-pin thin QFN package (6mm x 6mm) with an exposed paddle. Electrical performance is guaranteed over the extended temperature range, from TC = -40C to +85C. Features 1700MHz to 2200MHz RF Frequency Range 1400MHz to 2000MHz LO Frequency Range (MAX9995) 1900MHz to 2400MHz LO Frequency Range (Contact Factory) 40MHz to 350MHz IF Frequency Range 6.1dB Conversion Gain +25.6dBm Input IP3 9.8dB Noise Figure MAX9995 66dBc 2RF-2LO Spurious Rejection at PRF = -10dBm Dual Channels Ideal for Diversity Receiver Applications Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 50dB LO1-LO2 Isolation and 50ns Switching Time 44dB Channel-to-Channel Isolation Applications UMTS/WCDMA and cdma2000(R) 3G Base Stations DCS1800 and EDGE Base Stations PCS1900 and EDGE Base Stations PHS/PAS Base Stations Fixed Broadband Wireless Access Wireless Local Loop Private Mobile Radio Military Systems Pin Configuration/ Functional Diagram 33 IFM+ Ordering Information PART TEMP RANGE TC = -40C to +85C TC = -40C to +85C TC = -40C to +85C PIN-PACKAGE 36 Thin QFN-EP* 36 Thin QFN-EP* lead free, bulk 36 Thin QFN-EP* lead free, T/R MAX9995ETX MAX9995ETX-T TC** = -40C to +85C 36 Thin QFN-EP* TOP VIEW 36 VCC 29 LO_ADJ_M 31 IND_EXTM 35 IFM_SET 32 IFM- 34 GND 28 N.C. 30 VCC RFMAIN TAPMAIN GND VCC GND VCC GND TAPDIV RFDIV 1 2 3 4 5 6 7 8 9 EXPOSED PADDLE 27 LO2 GND MAX9995ETX+D MAX9995ETX+TD MAX9995 26 25 24 23 22 21 20 19 GND GND LOSEL GND VCC GND LO1 *EP = Exposed pad. **TC = Case temperature. 10 11 12 13 14 15 16 17 LO_ADJ_D IND_EXTD IFD_SET GND IFD+ 6mm x 6mm THIN QFN (EXPOSED PADDLE) EXPOSED PADDLE ON THE BOTTOM OF THE PACKAGE N.C. IFD- VCC VCC 18 cdma2000 is a registered trademark of Telecommunications Industry Association. 1 ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 ABSOLUTE MAXIMUM RATINGS VCC ........................................................................-0.3V to +5.5V LO1, LO2 to GND ...............................................................0.3V IFM_, IFD_, IFM_SET, IFD_SET, LOSEL, LO_ADJ_M, LO_ADJ_D to GND.............-0.3V to (VCC + 0.3V) RFMAIN, RFDIV, and LO_ Input Power ..........................+20dBm RFMAIN, RFDIV Current (RF is DC shorted to GND through balun) ..................................................................................50mA Continuous Power Dissipation (TA = +70C) 36-Lead Thin QFN (derate 26mW/C above +70C).............................................................2100mW JA .................................................................................+38C/W JC ................................................................................+7.4C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Maximum Junction Temperature Range..........................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Note A: TC is the temperature on the exposed paddle of the package. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, no input RF or LO signals applied, VCC = 4.75V to 5.25V, TC = -40C to +85C. Typical values are at VCC = 5.0V, TC = +25C, unless otherwise noted.) PARAMETER Supply Voltage SYMBOL VCC Total supply current VCC (pin 16) Supply Current ICC VCC (pin 30) IFM+/IFM- (total of both) IFD+/IFD- (total of both) LOSEL Input High Voltage LOSEL Input Low Voltage LOSEL Input Current VIH VIL IIL and IIH -10 2 0.8 +10 CONDITIONS MIN 4.75 TYP 5 332 82 97 70 70 MAX 5.25 380 90 110 90 90 V V A mA UNITS V AC ELECTRICAL CHARACTERISTICS (Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER RF Frequency LO Frequency SYMBOL fRF fLO (Note 7) (Note 7) (Contact factory) (Note 7) Meeting RF and LO frequency ranges; IF matching components affect the IF frequency range (Note 7) fRF = 1710MHz to 1875MHz Conversion Gain GC fRF = 1850MHz to 1910MHz fRF = 2110MHz to 2170MHz CONDITIONS MIN 1700 1400 1900 40 TYP MAX 2200 2000 2400 350 UNITS MHz MHz MHz MHz IF Frequency fIF 6 6.2 6.1 dB 2 _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch AC ELECTRICAL CHARACTERISTICS (continued) (Typical Application Circuit, VCC = 4.75V to 5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, fRF = 1700MHz to 2200MHz, fLO = 1400MHz to 2000MHz, fIF = 200MHz, with fRF > fLO, TC = -40C to +85C. Typical values are at VCC = 5.0V, PLO = 0dBm, fRF = 1900MHz, fLO = 1700MHz, fIF = 200MHz, and TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL VCC = 5.0V, TC = +25C, PLO = 0dBm, PRF = -10dBm (Note 3) CONDITIONS fRF = 1710MHz to 1875MHz fRF = 1850MHz to 1910MHz fRF = 2110MHz to 2170MHz MIN TYP 0.5 0.5 0.5 0.75 NF No blockers present fRF = 1710MHz to 1875MHz fRF = 1850MHz to 1910MHz fRF = 2110MHz to 2170MHz Noise Figure (with Blocker) Input 1dB Compression Point Input Third-Order Intercept Point 2RF-2LO Spur Rejection P1dB IIP3 2x2 8dBm blocker tone applied to RF port at 2000MHz, fRF = 1900MHz, fLO = 1710MHz, PLO = -3dBm (Note 3) (Notes 3, 4) fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1800MHz (Note 3) fRF = 1900MHz, fLO = 1700MHz, fSPUR = 1766.7MHz (Note 3) fLO = 1400MHz to 2000MHz fLO = 1400MHz to 2000MHz fLO = 1400MHz to 2000MHz fRF = 1700MHz to 2200MHz, fIF = 200MHz PLO1 = 0dBm, PLO2 = 0dBm (Note 5) PRF = -10dBm, RFMAIN (RFDIV) power measured at IFDIV (IFMAIN), relative to IFMAIN (IFDIV), all unused parts terminated at 50 50% of LOSEL to IF settled to within 2 LO port selected LO port unselected 40 PRF = -10dBm PRF = -5dBm PRF = -10dBm PRF = -5dBm 70 60 9.5 23 9.7 9.8 9.9 22 12.6 25.6 66 dBc 61 88 dBc 78 -29 -17 -25 37 50.5 dBm dBm dBm dB dB dB dBm dBm dB MAX 1 1 1 dB dB UNITS MAX9995 Gain Variation from Nominal Gain Variation with Temperature Noise Figure 3RF-3LO Spur Rejection Maximum LO Leakage at RF Port Maximum 2LO Leakage at RF Port Maximum LO Leakage at IF Port Minimum RF to IF Isolation LO1-LO2 Isolation Minimum Channel-to-Channel Isolation LO Switching Time RF Return Loss LO Return Loss 3x3 40 44 dB 50 14 18 21 ns dB dB IF Return Loss LO driven at 0dBm, RF terminated into 50 21 dB Note 1: Guaranteed by design and characterization. Note 2: All limits reflect losses of external components. Output measurements taken at IF outputs of Typical Application Circuit. Note 3: Production tested. Note 4: Two tones 3MHz spacing, -5dBm per tone at RF port. Note 5: Measured at IF port at IF frequency. fLO1 and fLO2 are offset by 1MHz. Note 6: IF return loss can be optimized by external matching components. Note 7: Operation outside this frequency band is possible but has not been characterized. See the Typical Operating Characteristics. _______________________________________________________________________________________ 3 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Operating Characteristics (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) CONVERSION GAIN vs. RF FREQUENCY MAX9995 toc01 CONVERSION GAIN vs. RF FREQUENCY MAX9995 toc02 CONVERSION GAIN vs. RF FREQUENCY 6.4 6.3 CONVERSION GAIN (dB) 6.2 6.1 6.0 5.9 5.8 5.7 5.6 5.5 VCC = 5.25V 1700 1800 1900 2000 2100 2200 VCC = 5.0V VCC = 4.75V MAX9995 toc03 8.0 7.5 7.0 CONVERSION GAIN (dB) 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 1700 1800 1900 2000 2100 TC = +85C TC = +25C TC = -20C 6.5 6.4 6.3 CONVERSION GAIN (dB) 6.2 6.1 6.0 5.9 5.8 5.7 5.6 5.5 PLO = -3dBm to +3dBm 6.5 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY MAX9995 toc04 INPUT IP3 vs. RF FREQUENCY MAX9995 toc05 INPUT IP3 vs. RF FREQUENCY VCC = 5.25V MAX9995 toc06 26.8 TC = +85C 26.4 26.0 IIP3 (dBm) 26.6 26.4 26.2 IIP3 (dBm) 26.0 25.8 25.6 PLO = -3dBm 25.4 25.2 PLO = 0dBm PLO = +3dBm 27.0 26.6 26.2 IIP3 (dBm) 25.8 25.4 25.0 24.6 25.6 TC = -20C 25.2 24.8 24.4 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) TC = +25C VCC = 4.75V VCC = 5.0V 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) 2RF - 2LO vs. FUNDAMENTAL FREQUENCY MAX9995 toc07 2RF - 2LO vs. FUNDAMENTAL FREQUENCY MAX9995 toc08 2RF - 2LO vs. FUNDAMENTAL FREQUENCY PRF = -5dBm 64 62 2RF - 2LO (dBc) 60 58 56 54 52 50 VCC = 5.25V VCC = 5.0V VCC = 4.75V MAX9995 toc09 75 70 65 2RF - 2LO (dBc) 60 55 50 45 40 35 30 PRF = -5dBm 66 PRF = -5dBm 64 62 2RF - 2LO (dBc) 60 58 56 54 52 50 PLO = 0dBm PLO = +3dBm PLO = -3dBm 66 TC = +85C TC = +25C TC = -20C 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) 4 _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) 3RF - 3LO vs. FUNDAMENTAL FREQUENCY MAX9995 toc10 3RF - 3LO vs. FUNDAMENTAL FREQUENCY MAX9995 toc11 3RF - 3LO vs. FUNDAMENTAL FREQUENCY 86 84 3RF - 3LO (dBc) 82 80 78 76 74 72 VCC = 4.75V VCC = 5.25V PRF = -5dBm VCC = 5.0V MAX9995 toc12 90 88 86 3RF - 3LO (dBc) 84 82 80 78 76 74 72 70 PRF = -5dBm TC = -20C TC = +25C 88 PRF = -5dBm 86 PLO = -3dBm 84 3RF - 3LO (dBc) 82 80 78 76 74 72 PLO = +3dBm PLO = 0dBm 88 TC = +85C 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY MAX9995 toc13 INPUT P1dB vs. RF FREQUENCY MAX9995 toc14 INPUT P1dB vs. RF FREQUENCY 14.2 14.0 13.8 P1dB (dBm) 13.6 13.4 13.2 13.0 VCC = 5.0V VCC = 5.25V MAX9995 toc15 14.4 TC = +25C 14.0 TC = +85C 13.8 13.7 13.6 13.5 PLO = -3dBm P1dB (dBm) PLO = 0dBm 14.4 P1dB (dBm) 13.6 13.4 13.3 13.2 13.2 12.8 TC = -20C 12.4 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) 13.1 13.0 12.9 1700 1800 1900 PLO = +3dBm 12.8 12.6 12.4 VCC = 4.75V 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) LO SWITCH ISOLATION vs. LO FREQUENCY MAX9995 toc16 LO SWITCH ISOLATION vs. LO FREQUENCY MAX9995 toc17 LO SWITCH ISOLATION vs. LO FREQUENCY VCC = 4.75V TO 5.25V MAX9995 toc18 55 54 53 ISOLATION (dB) 52 51 50 49 48 47 46 45 1400 1500 1600 1700 1800 1900 TC = +85C TC = +25C TC = -20C 54 53 PLO = -3dBm 52 ISOLATION (dB) PLO = 0dBm 51 PLO = +3dBm 50 49 48 47 54 53 52 ISOLATION (dB) 51 50 49 48 47 2000 1400 1500 1600 1700 1800 1900 2000 1400 1500 1600 1700 1800 1900 2000 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) _______________________________________________________________________________________ 5 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) CHANNEL ISOLATION vs. RF FREQUENCY MAX9995 toc19 CHANNEL ISOLATION vs. RF FREQUENCY MAX9995 toc20 CHANNEL ISOLATION vs. RF FREQUENCY MAX9995 toc21 80 TC = +85C 70 ISOLATION (dB) 60 50 40 30 20 1700 1800 1900 2000 2100 TC = -20C TC = +25C 90 80 PLO = +3dBm ISOLATION (dB) 70 60 PLO = -3dBm 50 40 30 PLO = 0dBm 90 80 VCC = 4.75V ISOLATION (dB) 70 60 50 40 30 VCC = 5.25V VCC = 5.0V 2200 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) LO LEAKAGE AT IF PORT vs. LO FREQUENCY MAX9995 toc22 LO LEAKAGE AT IF PORT vs. LO FREQUENCY MAX9995 toc23 LO LEAKAGE AT IF PORT vs. LO FREQUENCY MAX9995 toc24 -20 -25 -30 LEAKAGE (dBm) -35 -40 -45 -50 -55 -60 1400 1500 1600 1700 1800 1900 TC = +85C TC = +25C TC = -20C -25 -30 LEAKAGE (dBm) -35 -40 -45 -50 -55 PLO = -3dBm -25 -30 LEAKAGE (dBm) VCC = 5.25V -35 -40 VCC = 4.75V PLO = +3dBm PLO = 0dBm -45 VCC = 5.0V -50 2000 1400 1500 1600 1700 1800 1900 2000 1400 1500 1600 1700 1800 1900 2000 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY MAX9995 toc25 LO LEAKAGE AT RF PORT vs. LO FREQUENCY MAX9995 toc26 LO LEAKAGE AT RF PORT vs. LO FREQUENCY VCC = 4.75V TO 5.25V -25 -30 MAX9995 toc27 -20 -25 -30 LEAKAGE (dBm) -35 -40 -45 -50 -55 1400 1500 1600 1700 1800 1900 TC = +25C TC = +85C TC = -20C -20 -25 LEAKAGE (dBm) -30 -35 -40 -45 -50 PLO = -3dBm PLO = +3dBm -20 LEAKAGE (dBm) 1900 2000 -35 -40 -45 -50 PLO = 0dBm 1800 -55 -60 1400 1500 1600 1700 1800 1900 2000 2000 1400 1500 1600 1700 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) 6 _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) RF TO IF ISOLATION vs. RF FREQUENCY MAX9995 toc28 RF TO IF ISOLATION vs. RF FREQUENCY 45 44 ISOLATION (dB) 43 42 41 40 39 PLO = -3dBm TO +3dBm MAX9995 toc29 RF TO IF ISOLATION vs. RF FREQUENCY MAX9995 toc30 45 44 43 ISOLATION (dB) 42 41 40 39 38 1700 1800 1900 2000 2100 TC = +25C TC = -20C TC = +85C 46 43.0 42.5 42.0 ISOLATION (dB) 41.5 41.0 40.5 40.0 39.5 VCC = 4.75V VCC = 5.0V VCC = 5.25V 38 37 36 2200 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY MAX9995 toc31 NOISE FIGURE vs. RF FREQUENCY MAX9995 toc32 NOISE FIGURE vs. RF FREQUENCY 10.4 10.3 NOISE FIGURE (dB) 10.2 10.1 10.0 9.9 9.8 9.7 9.6 VCC = 4.75V MAX9995 toc33 14 13 12 NOISE FIGURE (dB) 11 10 9 8 7 6 1700 1800 1900 2000 2100 TC = -20C TC = +85C TC = +25C 10.2 PLO = -3dBm 10.1 NOISE FIGURE (dB) PLO = 0dBm 10.0 9.9 9.8 9.7 9.6 PLO = +3dBm 10.5 VCC = 5.25V VCC = 5.0V 9.5 1700 1800 1900 2000 2100 2200 1700 1800 1900 2000 2100 2200 FREQUENCY (MHz) FREQUENCY (MHz) 2200 FREQUENCY (MHz) RF RETURN LOSS vs. RF FREQUENCY MAX9995 toc34 IF RETURN LOSS vs. IF FREQUENCY MAX9995 toc35 LO RETURN LOSS vs. LO FREQUENCY (LO INPUT SELECTED) MAX9995 toc36 0 PLO = -3dBm TO +3dBm 5 RETURN LOSS (dB) 10 15 20 25 30 1700 1800 1900 2000 2100 0 5 10 RETURN LOSS (dB) 15 20 25 30 35 40 45 0 5 RETURN LOSS (dB) 10 PLO = +3dBm 15 PLO = 0dBm 20 PLO = -3dBm 25 40 80 120 160 200 240 280 320 360 FREQUENCY (MHz) 1400 1500 1600 1700 1800 1900 2000 FREQUENCY (MHz) 2200 FREQUENCY (MHz) _______________________________________________________________________________________ 7 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Operating Characteristics (continued) (Typical Application Circuit, VCC = 5.0V, PRF = -5dBm, PLO = 0dBm, LO is low-side injected for a 200MHz IF, TC = +25C.) LO RETURN LOSS vs. LO FREQUENCY (LO INPUT UN SELECTED) MAX9995 toc37 SUPPLY CURRENT vs. TEMPERATURE (TC) 360 355 SUPPLY CURRENT (mA) 350 345 340 335 330 325 320 315 310 VCC = 4.75V VCC = 5.25V VCC = 5.0V MAX9995 toc38 0 PLO = -3dBm TO +3dBm 5 RETURN LOSS (dB) 10 15 20 25 30 35 1400 1500 1600 1700 1800 1900 365 2000 -20 -5 10 FREQUENCY (MHz) 25 40 55 TEMPERATURE (C) 70 85 Pin Description PIN 1 2 3, 5, 7, 12, 20, 22, 24, 25, 26, 34 4, 6, 10, 16, 21, 30, 36 8 9 11 13, 14 15 17 18, 28 19 23 NAME RFMAIN TAPMAIN GND VCC TAPDIV RFDIV IFD_SET IFD+, IFDIND_EXTD LO_ADJ_D N.C. LO1 LOSEL FUNCTION Main Channel RF Input. Internally matched to 50. Requires an input DC-blocking capacitor. Main Channel Balun Center Tap. Connect a 0.033F capacitor from this pin to the board ground. Ground Power Supply. Connect bypass capacitors as close to the pin as possible (see the Typical Application Circuit). Diversity Channel Balun Center Tap. Connect a 0.033F capacitor from this pin to the ground. Diversity Channel RF Input. Internally matched to 50. Requires an input DC-blocking capacitor. IF Diversity Amplifier Bias Control. Connect a 1.2k resistor from this pin to ground to set the bias current for the diversity IF amplifier. Diversity Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. LO Diversity Amplifier Bias Control. Connect a 392 resistor from this pin to ground to set the bias current for the diversity LO amplifier. No Connection. Not internally connected. Local Oscillator 1 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. Local Oscillator Select. Set this pin to high to select LO1. Set to low to select LO2. 8 _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch Pin Description (continued) PIN 27 29 31 32, 33 35 Exposed Paddle NAME LO2 LO_ADJ_M IND_EXTM IFM-, IFM+ IFM_SET GND DESCRIPTION Local Oscillator 2 Input. This input is internally matched to 50. Requires an input DC-blocking capacitor. LO Main Amplifier Bias Control. Connect a 392 resistor from this pin to ground to set the bias current for the main LO amplifier. Connect a 10nH inductor from this pin to ground to increase the RF-IF and LO-IF isolation. Main Mixer Differential IF Output. Connect pullup inductors from each of these pins to VCC (see the Typical Application Circuit). IF Main Amplifier Bias Control. Connect a 1.2k resistor from this pin to ground to set the bias current for the main IF amplifier. Exposed Ground Plane. This paddle affects RF performance and provides heat dissipation. The paddle must be connected to ground. MAX9995 Detailed Description The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain and +25.6dBm IIP3, with a 9.8dB noise figure. Integrated baluns and matching circuitry allow 50 single-ended interfaces to the RF and LO ports. A single-pole, double-throw (SPDT) LO switch provides 50ns switching time between LO inputs, with 50dB LO-to-LO isolation. Furthermore, the Table 1. Component Values COMPONENT C1, C8 C2, C7 C3, C6 C4, C5, C14, C16 C9, C13, C15, C17, C18 C10, C11, C12, C19, C20, C21 L1, L2, L4, L5 L3, L6 R1, R4 R2, R5 R3, R6 T1, T2 VALUE 4pF 10pF 0.033F 22pF 0.01F 150pF 330nH 10nH 1.21k 392 10 4:1 (200:50) DESCRIPTION Microwave capacitors (0402) Microwave capacitors (0402) Microwave capacitors (0603) Microwave capacitors (0402) Microwave capacitors (0402) Microwave capacitors (0603) Wire-wound high-Q inductors (0805) Wire-wound high-Q inductors (0603) 1% resistors (0402) 1% resistors (0402) 1% resistors (1206) IF baluns integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9995's inputs to -3dBm. The IF port incorporates a differential output, which is ideal for providing enhanced 2RF-2LO performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS/WCDMA and 2G/2.5G/3G DCS1800, PCS1900, and cdma2000 base stations. The MAX9995 is specified to operate over an RF input range of 1700MHz to 2200MHz, an LO range of 1400MHz to 2000MHz, and an IF range of 40MHz to 350MHz. Operation beyond this is possible; however, performance is not characterized. This device can operate in high-side LO injection applications with an extended LO range, but performance degrades as fLO continues to increase. For a device with better highside performance, contact the factory. This device is available in a compact 6mm x 6mm, 36-pin thin QFN package with an exposed paddle. RF Input and Balun The MAX9995's two RF inputs (RFMAIN and RFDIV) are internally matched to 50, requiring no external matching components. DC-blocking capacitors are required as the inputs are internally DC shorted to ground through the on-chip baluns. Input return loss is typically 14dB over the entire RF frequency range of 1700MHz to 2200MHz. LO Input, Switch, Buffer, and Balun The mixers can be used for either high-side or low-side injection applications with an LO frequency range of 1400MHz to 2000MHz. For a device with an LO frequency range of 1900MHz to 2400MHz, contact the factory. As an added feature, the MAX9995 includes an 9 _______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Typical Application Circuit C19 T1 VCC L1 R3 C21 IF MAIN OUTPUT L2 4:1 R1 VCC C20 L3 R2 VCC IFM- IND_EXTM IFM+ LO_ADJ_M C18 C17 IFM_SET GND C1 RF MAIN INPUT 28 N.C. 35 33 31 30 VCC VCC 29 36 34 32 RFMAIN TAPMAIN C16 1 2 3 4 5 6 7 8 9 EXPOSED PADDLE 27 LO2 GND GND GND LOSEL GND VCC VCC GND LO1 C14 C15 LO SELECT LO2 MAX9995 26 25 24 23 22 21 20 19 C3 VCC C2 GND VCC C4 VCC C5 C6 GND VCC GND C7 TAPDIV RFDIV C8 RF DIV INPUT LO1 10 11 13 14 15 16 IND_EXTD IFD_SET GND IFD+ C9 R4 LO_ADJ_D VCC N.C. IFD- VCC VCC 18 12 17 R5 VCC C13 L6 C11 T2 L5 VCC R6 C12 L4 4:1 IF DIV OUTPUT C10 10 ______________________________________________________________________________________ Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic high selects LO1, and logic low selects LO2. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DC-blocking capacitor. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). MAX9995 Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning the resistors R1, R2, R4, and R5. If reduced current is required at the expense of performance, contact factory. If the 1% bias resistor values are not readily available, substitute standard 5% values. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower-level ground planes. This method provides a good RF/thermal-conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9995 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. High Linearity Mixers The core of the MAX9995 is a pair of double-balanced, high-performance passive mixers. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2RF-2LO rejection, and NF performance is typically +25.6dBm, 66dBc, and 9.8dB, respectively. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin with a capacitor as close to the pin as possible (Typical Application Circuit). Differential IF Output Amplifiers The MAX9995 mixers have an IF frequency range of 40MHz to 350MHz. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2RF-2LO rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. After the balun, VSWR is typically 1.5:1. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9995's 36-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9995 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. Return loss at each RF port is typically 14dB over the entire input range (1700MHz to 2200MHz), and return loss at the LO ports is typically 18dB (1400MHz to 2000MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS ______________________________________________________________________________________ 11 Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9995 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) D2 D D/2 k C L b D2/2 E/2 E2/2 E (NE-1) X e C L E2 k e (ND-1) X e L e L C L C L L1 L L e e A1 A2 A PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 21-0141 E 1 2 12 ______________________________________________________________________________________ QFN THIN 6x6x0.8.EPS Dual, SiGe, High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) MAX9995 NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT FOR 0.4mm LEAD PITCH PACKAGE T4866-1. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. PACKAGE OUTLINE 36, 40, 48L THIN QFN, 6x6x0.8mm 21-0141 E 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. |
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